The Thermal Performance Improvements of HP-LED Interconnected by Au80Sn20

摘要：

　　HP-LEDs interconnected by Au80Sn20,solder paste and silver paste are prepared.The thermal characteristics are tested by 3Ster.By the thermal resistance comparison,the thermal resistance of HP-LED interconnected by Au80Sn20 is obviously lower than that of the HP-LED interconnected by silver paste.The effects of heating method between bottom and top heating together with bottom heating are compared.Last the shear force of HP-LEDs interconnected by different material is tested.The HP-LED interconnected by Au80Sn20 showed better thermal and mechanical performances.

关键词： HP-LED thermal eutectic interconnect pn-junction temperature thermal resistance

作者: Luqiao Yin Meijuan Fu Fei Weng Jianhua Zhang

作者单位: Key Laboratory of Advanced Display and System Applications(Shanghai University), Ministry of Education,School of Mechatronics and Automation, Shanghai University P.O.B 143, 149 Yanchang Rd., Shanghai University, Shanghai 200072, P.R.China

会议类型: 国际会议

会议名称: 9th China International Forum on Solid State Lighting(第九届中国国际半导体照明论坛)

会议地点: 广州

会议语种:英文

页码: 97-99

在线出版日期: 2012-11-05（万方平台首次上网日期，不代表论文的发表时间）