Modular Approach for a High Powered LED Design Package
LEDs are penetrating into niche markets that demand very high quality light,temperature stability,lifetime reliability but maintain commercially viable in relatively small quantities We will discuss the optical,electrical,thermal and mechanical requirements on such components that can meet these modular design ideals,detailing:-influence of chip-bonding and substrate matedal on thermal resistance,optical and electrical parameters,-mechanical mismatch and choice of materials,An example of a modular high-power 4-chip design,based on established and proven standard materials and technologies and their combination,will be proposed.This requires a flexible modular approach in order to react within short time horizons and maintaining reliable designs.
Modular design thermal, electrical, optical and mechanical requirements and design COB
Siegmund Kobilke David Cheung
Excelitas Technologies ELCOS GmbH, Luitpoldstr.6, D-85276 Pfaffenhofen, Germany,Siegmund Excelitas Technologies(Hongkong)Co., Ltd., 30, Canton Road, TST, Hongkong(SAR)
国际会议
9th China International Forum on Solid State Lighting(第九届中国国际半导体照明论坛)
广州
英文
140-145
2012-11-05（万方平台首次上网日期，不代表论文的发表时间）