Challenging Joining Technologies for Advanced LED Packaging

摘要：

　　One of the key technological challenges in LED packaging is the thermal management in the complete package.The main issues for a reliable and long term stable LED are the heat dissipation and the CTE mismatch within the LED package.To optimise the heat dissipation and the CTE mismatch between the different components,three new joining technologies were introduced and their pros and cons are discussed in this article.These new challenging techniques are transient liquid phase bonding,transient liquid phase soldering and silver sintering.

关键词： LED packaging transient liquid phase bonding transient liquid phase soldering silver sintering CTE mismatch heat dissipation

作者: Lena Goullon Rafael Jordan Christian Ehrhardt Matthias Hutter Hermann Oppermann

作者单位: Fraunhofer IZM,Berlin, Germany

会议类型: 国际会议

会议名称: 9th China International Forum on Solid State Lighting(第九届中国国际半导体照明论坛)

会议地点: 广州

会议语种:英文

页码: 146-149

在线出版日期: 2012-11-05（万方平台首次上网日期，不代表论文的发表时间）