Thermal Management of IC Chips Integrated in WLP-SSL Module

摘要：

　　Future LED modules will include LEDs,driver,controller and even sensors and communications.The working temperature of IC chips is highly affected by LEDs,the main source of heat generation.This paper discusses what will happen,from the thermal management point of view,when the IC chips are integrated together with LEDs in a wafer-level package (WLP).And what can be done to reduce the negative influences.

关键词： Solid State Lighting (SSL) Light Emitting Diode (LED) Wafer Level Packaging (WLP) Thermal management IC Chip Driver

作者: Mingzhi Dong Jia Wei Cadmus Yuan Kouchi Zhang

作者单位: Beijing Research Centre, Delft University of Technology, No.A35 QingHua East Road, Haidian District, DIMES, Delft University of Technology, Feldmannweg 17, 2628 CT, Delft, the Netherlands State Key Laboratory of Solid State Lighting, No.A35 QingHua East Road, Haidian District, Beijing, 1

会议类型: 国际会议

会议名称: 9th China International Forum on Solid State Lighting(第九届中国国际半导体照明论坛)

会议地点: 广州

会议语种:英文

页码: 192-195

在线出版日期: 2012-11-05（万方平台首次上网日期，不代表论文的发表时间）