Design on UHV System with TSP
A UHV(ultra-high vacuum) system,which used as deposition equipment with the assistance of high and low vacuum measuring instruments and other accessories,was designed in this paper.A CMP (composite molecular pump) in parallel with TSP (titanium sublimation pump) as the main pump and a rotary-vane pump as the backing pump were designed in this system.After a CMP with displacement 23001/s was chosen as the one of the main pumps,the total flow conductance between the outlet of vacuum chamber and the CMP was 13441/s.The rough pump-down time was approximate 5 min by using a rotary-vane pump with pumping speeds 151/s.In order to ensure the normal operation of the main pumps,a water chilling unit was designed in the system,which can achieve limiting vacuum of 5×10-6pa in the vacuum chamber of 0.2 m3.
vacuum system selection and calculation structural design
Jinhua Zheng Conghui Li Chong Zhang Yunfeng Chao
Departments of Thermal Energy & Power Engineering, School of Chemical Engineering and Energy, Zhengz Departments of Thermal Energy & Power Engineering, School of Chemical Engineering and Energy, Zhengz
国际会议
石家庄
英文
319-322
2012-10-26（万方平台首次上网日期，不代表论文的发表时间）