会议专题

Simulation and Modeling of Wafer Level Silicon-Base Spiral Inductor

  With the development of radio frequency wireless communication technology,there are strong demands of spiral inductor with high performance and low profile.The inductor is a basic component of IPD (Integrated Passive Devices 1) including oscillators,filters,mixers and baluns.In this paper,the structure and process of fabricating a high performance wafer level silicon-base spiral inductor was presented and the effects of geometrical parameters on the inductance and quality factor were studied via a commercial 3-D EM 2 (Electromagnetic) simulator software.The performance was compared with the traditional on-chip embedded inductors.The results show that the number of turns and inner radius significantly impact the inductance and the performance of the mentioned spiral inductor is better than the traditional on-chip embedded inductors.

IPD EM RDL spiral inductor Q-factor silicon-base

Bian Xinhai Guo Hongyan Zhang Li KH Tan CM Lai

Jiangyin Changdian Advanced Packaging Co.,Ltd,JiangYin 214431,China

国际会议

2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

桂林

英文

29-31

2012-08-13(万方平台首次上网日期,不代表论文的发表时间)