Design and Optimization of a TSV 3D Packaged Pressure Sensor for High Temperature and Dynamic Measurement

摘要：

　　The piezoresistive pressure sensor has been used to measure the dynamic pressure as well as in high temperature environment.In this paper,a novel TSV 3D packaged pressure sensor is proposed for high temperature environment and dynamic measurement.The pressure sensors and the silicon carrier with TSV are flip chip bonded using Au/Sn eutectic for hermetic encapsulation.In order to reduce the stress generated by the package,two approaches of the bonding ring on the silicon carrier are taken into consideration.Different grooves designed in silicon carrier are simulated.The bonding ring plays a significant role while the shape of grooves in silicon carrier is not critical to the stress.

作者: Zhenhua Liu Xian Huang Zhiyuan Zhu Jing Chen Yufeng Jin

作者单位: National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Peking University,Beijin National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Peking University,Beijin

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 60-63

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）