A collaborative design from schematic to layout:based on MCP technology
With the rapid development of electronics technology,the technology continues to be miniaturization,multifunctionality,high bandwidth and low power consumption.System integration becomes more and more important.Multi-chip package (MCP) technology is one of the advanced technologies for system integration.A system or subsystem contains two-dimensional spaced multi-chips and a mass of passive components can be integrated into one single package using MCP technology.In this paper,there are four wire bond (WB) based bare chips and many passive components such as resistors and capacitors.To reduce the dimension of system,the MCP technology was used.Because of the complex of the system,a collaborative design process is necessary.It includes schematic design,layout and routing,design for manufacturability (DFM) and design for testability (DFT).In order to test the performance of the package,a test board was designed and manufactured.
Maoyun Pan Fengman Liu Liqiang Cao Ziguan Zhou Yang Li
Institute of Microelectronics of Chinese Academy of Sciences B503,3＃,BEITUCHENG West,CHAOYANG Distri Branch company of Communication and Electricity technology of State Grid Electricity Research Instit Acconsys science and technology limited company
国际会议
桂林
英文
90-93
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）