Research on Electroplating Process of SiC/Al Electronic Packaging Composites
In this study,in order to improve the surface properties and weldability of the high volume fraction SiC/Al composites,a novel method of nickel gold plating technology was investigated.Bright,dense,uniform,continuous nickel-gold plating layers formed on the surface of the composite,micrograph and composition of the layers were observed and analysed respectively.The experiment results showed that,the interface adhesion between the coatings and composite substrate is improved by the special process,and no impurities were found both in the Ni layers and Au layers.In addition,quality,thickness,conductivity,and air tightness of the coating layers were detected in the testing laboratory.The results showed that above performances of the layers met the requirement of the electronic packaging shell,and the plating layers offered good weldability.
SiC/Al composites Electroless nickel plating Gold plating EDX Coating morphology
WANG Kaikun DU Jianquan YANG Lei
School of Materials Science and Engineering,University of Science and Technology Beijing East-China Micro-Electronic Institute of Technology,Hefei,P.R.China 30 Xueyuan Road,Haidian District
国际会议
桂林
英文
208-211
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）