In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology

摘要：

　　In this paper,by using the synchrotron radiation real-time imaging,the growth of gas bubbles on solid-liquid interface during the soldering process was investigated.It was proved that the formation and growth of the bubbles was a process of heterogeneous nucleation.During the soldering heating insulation stage,the bubbles volume increased first and remained unchanged afterwards.When there were more than one bubbles,the annexation process was happened among the adjacent bubbles,the larger bubbles were pulled to the smaller ones.The bubbles volume remained unchanged during the cooling stage.At the same time,the dissolution of the Cu substrate and the growth of the IMCs were influenced by the bubbles.

作者: H T Ma L Qu H J Zhao J Wang L Y Gu L L An M L Huang

作者单位: School of Materials Sience&Engineering,Dalian University of Technology,Dalian University of Technology,No2 Linggong Road,Ganjingzi District,Dalian City,Liaoning Province

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 380-384

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）