TSV Modeling and Thermal Analysis Based on 3D Package

摘要：

　　TSV heat models with different pitches,straight through holes and circular truncated cones are established.Simulation results are obtained,and compared with wire bonding results.The conclusion that the heat dissipation effect of TSV technology is better than that of wire bonding technology is obtained.Heat dissipation effect has nothing to do with TSV shape under the same TSV pitches.

关键词： TSV 3D lamination electronic packaging

作者: Tian Wenchao Wang Wenlong Wang Hongming

作者单位: School of Electro-Mechanical Engineering,Xidian University,2 South Taibai Road,Xi’an,Shaanxi,710071,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 546-548

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）