Thermal Simulation and Analysis of Intelligent Power Module(IPM)Package

摘要：

　　The performance of intelligent power module (IPM) will severely degrade with high junction temperature.Thus,it’s important to get the thermal characterization of IPM package.In this paper,a method integrating electrical test method (ETM) and finite elements analysis (FEA) is put forward to analyze the thermal performance of a Transfer Molding IPM package.Electrical test method was used for thermal resistance test of the package under single freewheel diode heating in the one sixth module.The test results were then used for the calibration of finite elements model and boundary conditions.After validating the effectiveness of the finite element model and boundary conditions,thermal performance of the IPM package under multi-chip heating is obtained through numerical simulation.The method has certain practical meaning in the fast evaluation of power electronics’ thermal performance.

作者: Peisheng Liu Liangyu Tong Jinxin Huang Yujuan Tao Haijun Shen

作者单位: Jiangsu Key Laboratory of ASIC Design,Nantong University,Nantong,China,220619;Nantong Fujitsu Microe Jiangsu Key Laboratory of ASIC Design,Nantong University,Nantong,China,220619 Nantong Fujitsu Microelectronics Co.,Ltd.,Nantong,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 556-559

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）