Optimal Thermal Design of a High Power Package Using the Design of Experiment(DOE)

摘要：

　　Thermal management for package assembly,especially for high power packages,is very important to the reliability and quality of electrical products.In this paper,a finite element approach is proposed to investigate the thermal performance of TO252-5L(B) package attached on printed circuit board(PCB) with different layers and sizes,which is further related to reliability issue of this type of IC package.This single-factor method shows change trend of thermal resistance following materials and dimensions of package.Furthermore,design of experiment (DOE) approach is used to find the main factors and optimal combination of these control factors for minimizing of the thermal resistance for packages.The simulation results show that thermal conductivity of adhesive,die to die pad ratio,thermal conductivity of EMC and thermal test PCB board have significant impact on thermal resistance of TO252.In addition,interactions of those factors are also prominent,and the minimum thermal resistance of TO252 is 30.46K/W after optimization.

关键词： Thermal resistance Single-factor DOE Thermal test PCB board Finite element method

作者: GAO Cha QIN Fei ZHU Wenhui XIA Guofeng MA Xiaobo

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technolog College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technolog Packaging Technology Research Institute,Tian Shui Hua Tian Technology CO.,Ltd,Tianshui 741000,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 611-615

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）