Preparation of Thermal Interface Material Filled with Micro-nano-Composite Particles into the Polymer
With the rapid development of industrial production and micro-packing technology,the demand of thermal conductivity performance of materials becomes increasingly growing.Traditional metal materials have been unable to meet the use of certain special occasions.The thermal conductivity of pure polymer materials is poor,however,which can generally be changed by filling thermal conductive composite materials.This method to prepare high performance composite materials attracts more and more attention in recent years.The structures and performances of micro-nano core-shell composite particles can be designed.In this work,we synthesized a few core-shell composite particles with different sizes using sol-gel method,such as SiO2/Al2O3,SiO2/AlN,TiO2/Al2O3,Al2O3/AlN.The composite particles were filled into epoxy resin.The thermal conductivity and mechanical properties of SiO2/Al2O3 composite particles filled polymer composites are improved compared to SiO2&Al2O3-physical mixing particles filled polymer composites.The results show that particles of coreshell structure improve the thermal conductivity coefficient of the thermal interface polymer materials and reduce the interfacial heat resistance.The storage modulus in glassy state and rubbery state of SiO2/ Al2O3composite particles filled epoxy resin increased 15.4% and 85% compared to the 40wt% physical mixing particles filled epoxy resin and pure epoxy resin respectively.Furthermore,the bending strength of SiO2/Al2O3 composite particles filled epoxy resin is 1.9% lower than that of the 40wt% physical mixing particles filled epoxy resin.The thermal conductivity coefficient of epoxy resin with content of 30wt% micro-nano particles of coreshell structure is 34.4% higher than that of pure epoxy resin,and 8.8% higher than that of 30wt% physical mixing particles filled epoxy resin composite.It indicated that the composite particles of core-shell structure have good heat conduction paths to improve the thermal conductivity of thermal interface polymer materials.
thermal conductivity SiO2/Al2O3 composite particles
Rongrong Kuang Dayong Gui Lianggao Wu Guangfu Zeng Deqin Si Jianhong Liu
School of Chemistry and Chemical Engineering,Shenzhen University,Nanhai Ave 3688,Shenzhen,Guangdong 518060,P.R.China
国际会议
桂林
英文
695-699
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）