Design and Analysis of 2D Embedded Passive Devices in Printed Circuit Boards

摘要：

　　Embedded passives devices are becoming increasingly important for next generation miniaturized systems.A Printed circuit boards (PCBs) is investigated in this paper with focus on passive devices.Film resistance,capacitance and inductance are embedded into the same board.The effects of embedded capacitors and inductance on signal integrity (SI) and electromagnetic compatibility (EMC) have been simulated,measured, and compared with measured results derived from conventional discrete capacitors.A finite element,full-wave method was used to simulate and analyze the transmission characteristics.

作者: Jing Zhang Baoxia Li Lixi wan Liqiang Cao

作者单位: Institute of Microelectronics,Chinese Academy of Sciences,Beijing,100029,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 745-748

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）