Study of the effect on die backside stress from coating of a nitride layer

摘要：

　　Place a Die breaking strength is related to the surface morphology of the die.Existing of the defects on the die backside makes die fracture becomes a more severe problem in the microelectronic package.In this study,impact of the die backside defects on the stress is investigated by mechanical theories.Finite element method and 3 point bending test are used to verify the theory prediction.Thin layers of AlN were coated on the backside of the dice with different morphologies.Mechanical properties of these dice were tested by 3PB method.It is found that coating a thin layer of AlN on the die backside can increase the die breaking strength.Furthermore,the stress at the crack tip and its vicinity,with and without coating layer,has been compared by using finite element simulation.The results suggested that coating a thin layer of AlN on the die backside is a feasible way to improve the mechanical property of the package and protect the package from fracturing.

关键词： flip-chip coating layer die backside stress modification FEA 3PB defect stress intensity factor

作者: J.Liao S.H.Liu Y.T.Yu Y.Lin G.Jin G.Huang Z.Z.Fu

作者单位: State Key Laboratory of Electronic Thin films and Integrated Devices,University of Electronic Scienc Intel Products(Chengdu)Ltd.No.8-1 Kexin Road,Chengdu High-Tech Zone(West Park),Chengdu,Sichuan 61173

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 817-822

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）