Advanced Packaging Stepper for 300mm Wafer Process

摘要：

　　With development of advanced package technology,requirements for lithographic process become tighter than before.When dealing with 200mm or 300mm wafer,stepper shows better uniformity of CD and overlay.SSB500 stepper can be used in RDL and Bump process.This paper introduces features of SSB500 stepper,such as wide band exposure light source,large field size,flexible alignment strategy,direct focus measurement,and proposes absolute overlay error concept and measurement method based on golden wafer.It also provides test data for CDU,UDoF,overlay for single machine and matching,thick photo resist performance,which shows specification of the stepper meeting well with advanced package process.

作者: Zhou Chang Li Zhongyu Zhang Lei

作者单位: Shanghai Micro Electronics Equipment CO.,LTD.No.1525,Zhangdong Road,Pudong,Shanghai,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 936-939

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）