Introducing FCA,a New Alloy for Power Systems on a Chip and Wafer Level Magnetic Applications

摘要：

　　On chip integrated inductors and transformers require novel and improved materials and CMOS-compatible Wafer Level Magnetics (WLM) deposition techniques.In this work we are presenting an Fe-Co based amorphous magnetic alloy,called FCA that was specifically designed and developed by Enpirion to be used for the first time in volume production for highly integrated and miniaturized power management electronics.The FCA properties that make it suitable for use in a real product are: stable permeability to frequencies higher than 20MHz,high electrical resistivity ρ>120 μΩ-cm,high magnetic saturation Bs>1.5T,and ultra-low coercivity Hc<1.The fully CMOS-compatible FCA electro-deposition is carried out in JCAP’s wafer production fab in China using customized electroplating equipment that was specifically developed for the FCA plating chemistry.A microinductor utilizing an FCA magnetic core is developed,characterized and integrated into a DC-DC converter.This work demonstrates a commercially viable and available to market 1Amp DC-DC switching converter operating at 18MHz with efficiency up to 90% that utilizes electroplated magnetic materials on wafer for the first time in the power management industry.

作者: Trifon Liakopoulos Amrit Panda Matt Wilkowski Ashraf Lotfi KH Tan Li Zhang Chiming Lai Dong Chen

作者单位: Enpiron Inc,53 Frontage Road,Hampton,NJ08827,USA Jiangyin Changdian Advanced Packaging(JCAP)Co,LTD,No.275 Binjiang Rd,Jiangyin,Jiangsu,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 949-954

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）