A Primer to Applying Real Time Dispatching in Semiconductor Test Operations

摘要：

　　Balancing the capacity and effective use of tester equipment to fulfill customer orders in both wafer test and final test is an ongoing need.Challenges are growing in the coverage of die circuitry and probing,as well as validating chip performance against specification.Validation at the die test operation using the same tester equipment places added demand on manufacturing effectiveness.This paper describes how real-time dispatching in the wafer and die test improves overall factory performance at these test operations.

作者: Ng Yuh Lin

作者单位: Applied Materials South East Asia Pte Ltd 8 Upper Changi Road North,Singapore 506906

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1027-1029

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）