A Novel Type of Stacked Cylindrical PoP Package
With the reduction in size and weight for electronic products,particularly for accurate manufactures,the IC boards used to achieve complex circuit functions become smaller and lighter.It is also needed to make the board thin.The layers stacking assembly together will be more important,but the precision requirements of the device can not be reduced,either.The purpose of the stacked vertical interconnect is system miniaturization and smaller.This paper presents the IC in the internal of the device,planting copper pillars on one side to achieve the connection of the signal,the power and the ground.The copper pillars can make the connection more stable and the signal transmission better.The length of the copper pillar is easier to control,and the copper pillar under the heat of the board will generate little change in the length or other properties.The novel method meets both the signal transmission and securely connection between each device,and will not make the connectors bridged together.
Li-ye Cheng Ling-feng Shi Cheng-shan Cai Chen Meng Xin-quan Lai
Institute of Electronic CAD,Xidian University,Xi’an,Shaanxi 710071,China Key Lab of High-Speed Circuit Design and EMC,Ministry of Education,Xidian University,Xi’an,Shaanxi 7
国际会议
桂林
英文
1124-1127
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）