Research on BGA Solder Joint Two-dimensional Quality Information Extraction

摘要：

　　A extraction approach is proposed based on an image processing in order to improve the accuracy of 2D quality information extraction for surface mount technology (SMT) BGA(Ball Grid Array) solder joint of chip components.First,some appropriate image processing algorithms are utilized to eliminate the noise in the solder joint image.And a binaryzation image is obtained after character.Then the BGA Solder Joint 2D quality information extraction system is developed based on Visual C++,and the 2D quality information of solder joint circumference,area,void area,and diameter,are obtained.The experimental results have illustrated that the system can accomplish a good extraction result.

作者: Zhao Huihuang Wang Yaonan Sun Yaqi

作者单位: Department of Computer Science,Hengyang Normal University,HuNan,HengYang,421008,China Department of Control Science and Engineering,Hunan University,Hunan 410082,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1284-1286

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）