Thermo-mechanical Behaviour Analysis of Micro-solder Joints by Finite Element Modelling

摘要：

　　Modern trends in design of electrical products require miniaturization and multi-function.In line withthese trends,dimensions of lead-free solder joints reduce from over 100μm to 10μm,resulting in some new reliability issues.A high fraction of intermetallic compounds (IMC) with various shapes is a key feature in micro-solder joints.So far,fewinvestigations focused on the influence of high fraction of IMCs on thermal fatigue,which is of great importance forreliability of electronic devices.In this work a parameterized finite element model is presented and analyzed to find out the change in stress and strain distributions in micro-solder joints.Different thicknesses and shapes of IMC are simulated.Results show that both thickness and shape of IMC have significant effects on thermal stress and creep strain.

作者: X.Zha C.Liu V.V.Silberschmidt

作者单位: Wolfson School of Mechanical and Manufacturing Engineering,Loughborough University,Loughborough,Leicestershire,LE11 3TU,United Kingdom

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1329-1332

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）