Extraction of Anand Model Parameters for Mixed Solder Material by Tensile Test
In this paper,the Sn3.0Ag0.5Cu and 63Sn37Pb were mixed by a certain mass ratio to research reliability of mixed solder material.Firstly,in order to obtain the data of the 9 fitting Anand parameters of mixed solder joint material,a series of tensile tests were carried out under the condition of 5 strain rates from 5.0E-5/s to 1.0E-3/s and at 4 temperatures 253K,298K,348K and 398K.Secondly,the constant strain rate method was applied to tensile test at different temperature,and it is this test that must be repeated two times with the same test conditions,the same strain rate and the same temperature.Finally,the stress-strain curve was acquired.The 9 materials parameters of Anand model for mixed solder alloys were determined from experiments and least-square fitting of constitutive relation as well.Further,it is these parameters that can lay the foundation for the analysis of mixed solder joint thermal fatigue simulation and life prediction.
Zhou Bin Zhou Qing Pan Kailin Liu Ganggang
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,CEP Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,CEP School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology
国际会议
桂林
英文
1340-1343
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）