Failure Localization and Mechanism Analysis in System-on-Chip(SOC)using Advanced Failure Analysis Techniques

摘要：

　　As system-on-chip (SoC) becomes prevalent in the intelligent system applications,the reliability issue of SoC is getting more attention in the design industry.But due to the circuit complexity,the high pin counts and ever increasing operating frequencies,System-on -Chip (SoC) devices drive the most challenging requirements for failure localization and mechanism analysis.PEM (Photon Emission Microscopy) analysis is important for failure analysis as they can help to locate the failed device directly or point out the analysis direction.FIB (Focused Ion Beam) is also a useful tool in failure analysis which could provide cross section on visible defect.This paper presents a typical failure analysis case of the SoC for information processing and control using a 0.13μm process technology.And PEM and FIB are used to help us locate the failure site and analyze the failure mechanism.

作者: Yuan Chen Hui Chen Xiaowen Zhang Ping Lai

作者单位: Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,The Fifth Electronics Research Institute of Ministry of Industry and Information Technology No.110,Dongguanzhuang Road,Tianhe District,Guangzhou,Guangdong,P.R.China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1348-1351

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）