Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints
The relationships between the morphology of Ag3Sn phases and the cooling rate,solder volume and 0.7 wt.% Cu addition into Sn-3.5Ag solder were investigated in this study.The morphology of Ag3Sn phases in the solder joints was greatly affected by the cooling rate.In Sn-3.5Ag/ENEPIG (electroless nickel electroless podium immersion gold) solder joints,large plate-like Ag3Sn phases formed on the interfacial intermetallic compounds (IMCs) under furnace cooling,normal cooling and air cooling conditions,while no plate-like Ag3Sn phases formed under water cooling condition.The volume of solder ball also had a significant effect on the morphology of Ag3Sn phases in the solder joints.Large platelike Ag3Sn phases formed at the Sn-3.5Ag (50 μm)/ENEPIG (40 μm) and Sn-3.5Ag (100 μm)/ENEPIG (150 μm) interfaces under furnace cooling condition.However,no plate-like Ag3Sn phases were detected at the Sn-3.5Ag (200 μm)/ENEPIG (150 μm) interface under the same cooling condition.The degree of undercooling increased with downsizing solder joints,which would extend the growth time of Ag3Sn phases in the solidification process.The addition of 0.7 wt.% Cu into Sn-3.5Ag solder had little effect on the morphology of Ag3Sn phases in the solder joints.
Qiang Zhou Mingliang Huang Ning Zhao Zhijie Zhang
Electronic Packaging Materials Laboratory,School of Materials Science & Engineering,Dalian University of Technology,Dalian,China,116024
国际会议
桂林
英文
1403-1406
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）