Abnormal phase segregation induced by void formation in Cu/Sn-58Bi/Cu solder joint during current stressing

摘要：

　　This work focused on the electromigration (EM) behavior of the Cu/Sn-58Bi/Cu solder joint affected by the large void formation.The as-reflowed one-dimensional solder joint was stressed with current density of 5×103 A/cm2 at 80oC continuously for 144h.The microstructural evolution was observed and analyzed by SEM.Results indicated that the abnormal Sn/Bi phase segregation was observed at the cathode interface of the solder joint owing to the early serious defects formation.Local current flow was aggregated surrounding the large void,resulting in the Joule heating accumulation there.Therefore,the original straight direction of the electrons was altered near the void region,leading to the unusual Bi migration.

作者: Hongwen He Guangchen Xu Fu Guo

作者单位: Institute of Microelectronics of Chinese Academy of Sciences,Beijing,PR China College of Materials Science and Engineering,Beijing University of Technology,Beijing,PR China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1407-1410

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）