Development of a new die-attach process and related bonding tool for multi-chip LED module

摘要：

　　A new die-attach process was presented for the multichip LED module,and the related bonding tool for the LED module was also designed.With the new bonding process and the novel bonding tool,21 LED chips have been attached onto a single substrate within one bonding process.The investigation of bonding chips appearance and thickness of interface layer were carried out to evaluate the die-attach performance.The die-attach process has been optimized by studying the effects of bonding force on the die-attach performance.The results showed this method can provide a high die-attach precision as well as the chip attachment consistency.

作者: Chunjin Hang Hong Wang Jingming Fei Chunqing Wang

作者单位: State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology Harbin 150001,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1429-1431

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）