Research on eutectic bonding processes and interfacial damage features in high power LED package

摘要：

　　Metal bonding is the most promising die-attach process in high power LED package,which has lower thermal resistance and higher device reliability in comparison with the traditional insulation paste or silver paste die-attach processes.In this project,the eutectic bonding technology,flux-eutectic bonding technology and solder-bonding technology were studied,and the interfacial microstructure was observed and the failure features were revealed and analyzed.This study provided some basic date and a theoretical basis for the diebonding processes and especially gives a direction for the LED packaging industry.

作者: W.Liu P.Jin

作者单位: Shenzhen Graduate School of Pking University,School of environment and energy;321A,E Building,Shenzhen University Town,Xili,Shenzhen.P.R.C

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1432-1434

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）