Analysis on the Failure Modes and Mechanisms of LED Packaging

摘要：

　　In- and out-doors LED is a new device with excellent performance in power-saving,lighting efficiency,reaction time.Currently,it is widely used in communication,display,illumination.Reliability is a key point to promote its application.The most important reliability issue in LED modules is about packaging which includes refrigeration,bonding wire,the aging of organic material,good packaging design et al.In this paper,the failure modes and failure mechanisms of LED are reviewed,and some failure analysis cases are presented.

作者: Liu Xin Fang Wenxiao

作者单位: CEPREI,Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,No.110 Dongguanzhuang Rd.Guangzhou,510610,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1500-1502

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）