Sinter-Attach of High-Temperature Sensors for Deep-Drilling Monitoring

摘要：

　　An optimized fabrication process for high-temperature piezoresistive vibration sensors made of p-doped double-layer SOI material is described.Thus,an easy and straightforward production of very precise sensor geometries is now feasible.Subsequently,it is demonstrated that sintering of silver particles can be successfully applied for die attach of these MEMS sensors.Sintering takes place at a very low pressure of 4 N/mm2 and a temperature of 250℃ for 2 min.Furthermore,the attached sensors are tested according to the requirements of deep drilling projects such as geothermal power generation from deep geologic layers.In doing so,the operation of the bonded sensors under realistic conditions for vibration monitoring is analyzed,i.e.simultaneous temperature (250 ℃) and vibration (± 50 g) stress.

作者: Julian K(a)hler Andrej Stranz Erwin Peiner Andreas Waag

作者单位: TU Braunschweig,Institute of Semiconductor Technology Hans-Sommer-Stra(β)e 66,38106 Braunschweig,Germany

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1594-1599

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）