Development and Prospect of Advanced Packaging Materials
Electronic packaging plays a very important role in electronic industry.Nowadays,with the quickly development of electronics technology,integrated circuit is developing rapidly towards large scale,high speed,high density,high power,high-accuracy and multifunction.Thus,new packaging technologies emerged in endlessly,new packaging materials come forth unfailingly.The package performance on a great degree depends on the substrate materials you built with.Miniaturization and high speed require substrate materials have high mechanical performance,high moisture resistance,high reliability,easy processing and excellent electrical performance.Compared with plastics,ceramic packaging materials have imponderable advantages for high reliability package.
Hongyu Zheng
Hebei semiconductor research institute,China
国际会议
桂林
英文
1-1
2012-08-13（万方平台首次上网日期，不代表论文的发表时间）