Development of Advanced Packaging

摘要：

　　To satisfy smaller,thinner and lighter,new packaging including WLCSP,TSV,stack die has been replacing traditional packaging,especially in the mobile market.This report is illustrating the market and technology tendancy of semiconductor packaging.

作者: Jerry Zhang

作者单位: Sales VP of Jiangyin Changdian Advanced Packaging Co.,ltd(JCAP)

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 1-1

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）