High-temperature SOI pressure sensors on the base of the MEMS micromachining technology
There is a need of measuring distributed pressure on the compressor inlet of the aircraft engine with high precision within a wide operating temperature range to improve the efficiency of aircraft engine control.The basic solutions and principles of designing high-temperature (to 250oC) microelectromechanical pressure sensors based on a membrane-type SOI heterostructure (SOIMT-MEMS) with a monolithic integral tensoframe (MT) are proposed in accordance with the developed concept 1 which excludes the use of electric p-n junctions in semiconductor microelectromechanical sensors.The SOIMT-MEMS technology relies on the group processes of microelectronics and micromechanics for highprecision microprofiling of three-dimensional micromechanical structure which exclude high-temperature silicon doping processes.According to the design,manufacturing process and experiment results the technology was optimized and a pilot batch of SOIMT-MEMS samples with the regular geometry and without any undercuts of the tensoframe convex angles was manufactured.
pilot batch of SOIMT-MEMS pressure sensors high-temperature SOI heterostructure micromachining technology
L. V. Sokolov
Scientific Research Institute of Aircraft EquipmentZhukovsky, 140185, Russia
国际会议
2012第八届精密工程测量和仪器仪表国际研讨会(ISPEMI2012)
成都
英文
1-8
2012-08-08（万方平台首次上网日期，不代表论文的发表时间）