Electroless Deposition of Silver Layer on Silicon of High Density Plasma Bombarment

摘要：

　　Electroless silver film was deposited on the Ti/Si substrate which was suffered from plasma bombardment to modify its surface chemistry.The surface tension of the Ti/Si surface was found to be reduced after plasma bombardment.After thermal annealing, the silver film was smoothened and showed a fine microstructure.However, the recrystal at high temperature annealing facilitated an increase of sheet resistance instaneously.

关键词： electroless silver plasma bombardment surface tension sheet resistance

作者: Yuan-Gee Lee

作者单位: Department of Automation Engineering and Institute of Mechatronoptic Systems Chienkuo Technology University,Changhua 50094,Taiwan

会议类型: 国际会议

会议名称: the 3nd International Conference on Digital Manufacturing & Automation (第三届数字制造与自动化国际会议(ICDMA 2012))

会议地点: 桂林

会议语种:英文

页码: 474-477

在线出版日期: 2012-08-01（万方平台首次上网日期，不代表论文的发表时间）