Fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading

摘要：

　　The fracture behavior of a brittle thin film on an elastic substrate under residual stress and uniaxial tensile loading is investigated.It is assumed that the residual stress in the thin film is not large enough to cause the thin film to fracture.Using a mechanical model presented in this work, the analytical solutions for the distribution laws of the tensile stress developed in the thin film, the shear stress developed along the interface and the relationship between the crack density of the thin film and the applied strain of the substrate can be obtained.The results presented in this work can provide a new analytic solution to the interfacial shear stress for characterizing the interfacial shear strength of the thin film/substrate system when the uniaxial tensile test is adopted to evaluate the mechanical properties of the thin film/substrate system.

关键词： Residual stress Tensile loading Crack density Thin film/substrate system

作者: Ban-Quan Yang Xue-Jun Chen Wei-Hai Sun Hong-Qian Chen Jing-Wen Pan Ying Chen

作者单位: Division of Engineering Mechanics,Department of Mechanical Engineering,Academy of Armored Force Engi School of Applied Sciences,University of Science and Technology Beijing,No.30 Xue-Yuan Road,Beijing

会议类型: 国际会议

会议名称: the 3nd International Conference on Digital Manufacturing & Automation (第三届数字制造与自动化国际会议(ICDMA 2012))

会议地点: 桂林

会议语种:英文

页码: 487-490

在线出版日期: 2012-08-01（万方平台首次上网日期，不代表论文的发表时间）