Numerical Simulation on the Water-cooled Heat Sink for High-power Semiconductor
With the development of electronic technology,the cooling of the electronic devices,especially for high-power semiconductor,becomes more and more important.The aircooled technology is gradually replaced by the water-cooled technology with the excellent cooling ability.This paper simulates the flow field and temperature field of water-cooled heat sink with FLUENT,obtains the heat transferring performance and hydrodynamics property of heat sink,and compares the simulation results with experimental results.The compared results find the disadvantages of heat sink structure and provide information for the improvement.The application of FLUENT,with the function of three-dimension modeling,hydro-dynamics calculation and heat transfer calculation,in the design of heat sink can improve the structure of heat sink,save manufacture cost,reduce exploitation time,and enhance the independent exploitation ability.
FLUENT Modeling Numerical Simulation Water-cooled Heat Sink
Liu Yanping Yang Yuliang
School of Energy, Power and Mechanical Engineering North China Electric Power University Beijing 102206
国际会议
沈阳
英文
1161-1164
2012-07-27（万方平台首次上网日期，不代表论文的发表时间）