Consistency of High-g Acceleration sensor performance

摘要：

　　Based on the designed,packaged high-g acceleration sensor in measuring demonstrated sensor performance between individuals have big difference,Researched this problem,through the analysis that the main reason of this problem appeared in the sensor package process of Die process.Through ANSYS simulation and experimental test on two aspects of the analysis the die adhesives amount of Die process is the high-g acceleration sensor in testing large performance differences were the main factors.Packaged high-g acceleration sensors with die process of quantitative die adhesive were designed and tested their performance.The result showed that,the simulation results were consistent with experimental results.

关键词： die adhesive high-g acceleration sensor consistency test ANSYS

作者: Shi Yun-bo Zhang He Liu Jun Li Kejie

作者单位: School of Mechatronic Engineering, Beijing Institute of Technology, 100081 ,China; Key Laboratory of Key Laboratory of Instrumentation Science & Dynamic Measurement(North University of China),Ministry School of Mechatronic Engineering, Beijing Institute of Technology, 100081 ,China

会议类型: 国际会议

会议名称: the 2012 International Conference on Frontiers of Mechanical Engineering and Materials Engineering (机械工程与材料工程国际会议())

会议地点: 香港

会议语种:英文

页码: 101-104

在线出版日期: 2012-07-27（万方平台首次上网日期，不代表论文的发表时间）