The Study of Dynamic Stiffness for IC Chip Die with Parallel Mechanism

摘要：

　　The vibrating equation and the moving stiffness model are created for the Parallel Bonding Mechanism of the IC Chip Die designed.Its moving stiffness characteristic curves in whole working space are obtained though Matlab software and analyzed in this paper.Based on these characteristic curves,it proves that the moving stiffness of the Parallel Bonding Mechanism designed meets the working requirements of IC Chip Die.

关键词： Moving stiffness Characteristic curves Vibrating equation Parallel bonding mechanism

作者: Weidong Peng Zhiwei Wu

作者单位: Guangdong College of Industry & Commerce, NO.963 Guangzhou Road(N),Guangzhou,Guangdong Province,China

会议类型: 国际会议

会议名称: the 2012 International Conference on Frontiers of Mechanical Engineering and Materials Engineering (机械工程与材料工程国际会议())

会议地点: 香港

会议语种:英文

页码: 1643-1646

在线出版日期: 2012-07-27（万方平台首次上网日期，不代表论文的发表时间）