New Generations of Tools Sets That Enable FDSOI and 3-D Tri-Gate Technologies

摘要：

　　Today no insurmountable obstacles are foreseen inhibiting scaling logic devices to the 10nm node.Cost effective processes and equipment sets have been developed that allow both 3-D Tri-Gate and Ultra-Thin Body SO1 integration schemes to be scaled.This allows the equipment industry to focus on innovations of new material and their integration into cost effective tool sets in time for high volume manufacturing in sub 10nm node technology.In this paper we review various process challenges the equipment industry overcame to enable the 3-D Tri-Gate and Ultra-Thin Body SOl architecture in partnership with integrated device manufactures.

作者: Reza Arghavani Shashank Deshmukh David Hemker Gowri Kamarthy Jeff Marks Vahid Vahedi

作者单位: Lam Research Corporation 4650 Cushing Parkway Fremont, CA 94538 U.S.A.

会议类型: 国际会议

会议名称: 2012 12th International Workshop on Junction Technology (2012结技术国际研讨会(IWJT-2012))

会议地点: 上海

会议语种:英文

页码: 48-52

在线出版日期: 2012-05-10（万方平台首次上网日期，不代表论文的发表时间）