Microprobe Metrology for direct Sheet Resistance and Mobility characterization
The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads.Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers.Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance,mobility and active carrier density measurements using the collinear M4PP.In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.
Peter Folmer Nielsen Dirch H.Petersen Rong Lin Ane Jensen Henrik H.Henrichsen Lauge Gammelgaard Daniel Kjaer Ole Hansen
CAPRES A/S, Scion-DTU, building 373, DK-2800 Kgs.Lyngby, Denmark DTU Nanotech, Technical University of Denmark, building 345B, 2800 Kgs.Lyngby, Denmark CAPRES A/S, Scion-DTU, building 373, DK-2800 Kgs.Lyngby, Denmark ;DTU Nanotech, Technical University DTU Nanotech, Technical University of Denmark, building 345B, 2800 Kgs.Lyngby, Denmark ;CINF, Techni
国际会议
2012 12th International Workshop on Junction Technology (2012结技术国际研讨会(IWJT-2012))
上海
英文
100-105
2012-05-10(万方平台首次上网日期,不代表论文的发表时间)