Rheological Behavior of Diamond Particle/Epoxy Resin Adhesive Adapted to Screen Printing

摘要：

　　The thermal conductivity & insulating adhesive was prepared by mixed with diamond particles,epoxy resin (E-20),methanol etherified amino resin,ethylene glycol monobutyl ether (BCS),mixed diethyl ester (DBE),and other additives.The influence on rheological behavior of different particle sizes,volume content of diamond particles was studied.Meantime,the effect of different concentration of dispersant and flatting agent was also investigated.The mechanism of the rheological behavior was analyzed.

关键词： thermal conductivity & insulating rheological behavior diamond particle adhesive

作者: LV Yong SONG Ci LONG Zhu

作者单位: School of mechanical engineering and information, Yiwu industrial & commercial college, Yiwu 322000, Jiaxing vocational and technical College, Jiaxing 314036, China Key Laboratory of Eco-Textiles Ministry of Education, Jiangnan University, Wuxi 214122, China

会议类型: 国际会议

会议名称: 2012 International Symposium on Polymer Composites and Polymer Testing(ISPCPT2012)(2012高分子复合材料与测试学术研讨会)

会议地点: 杭州

会议语种:英文

页码: 308-311

在线出版日期: 2012-03-23（万方平台首次上网日期，不代表论文的发表时间）