Effect of filling with adhesive on Solder alloys subjected to Random vibration

摘要：

　　In order to obtain a better filling way with suitable adhesive to enhance the reliability of 3D PLUS solder joints.Finite element analysis of random vibration method was carried out.By means of the method,the effect of filling way on the stress distribution in solder joints was investigated under the condition of two types adhesives 55/9 and GD414.Stress distribution and its maximum value of 3D PLUS solder joint at peak time were acquired.Comparative analysis of the maximum stress between under filled adhesive and side filled adhesive with 55/9 or GD414 respectively.The results showed that under filled adhesive 55/9 can effectively improve the solder joint stress.

关键词： Solder joint Adhesive type Equivalent Stress Random vibration Finite element method

作者: Nuo Bao Chunjie Wang Lin Zhu Shunguang Song

作者单位: School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China

会议类型: 国际会议

会议名称: The 9th International Conference on History of Mechanical Technology and Mechanical Design (第9届中日机械技术史及机械设计国际会议(ICHMTMD 2012))

会议地点: 台湾

会议语种:英文

页码: 34-38

在线出版日期: 2012-03-23（万方平台首次上网日期，不代表论文的发表时间）