Simulation of Near-crack-tip Strain Fields on Single-crystal Silicon Wafer

摘要：

　　The failure components made of silicon is an important issue in the electronic and nano-technological developments.A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented.The strain formulas around the crack tip of mode Ⅰ crack were deduced from linear elastic fracture mechanics.The strain fields around the crack tip were simulated and analyzed in detail.

关键词： Strain Crack tip Single-crystal silicon

作者: J.J.Li C.W.Zhao Y.M.Xing Z.Y.Lv Y.G.Du

作者单位: Shool of Science, Inner Mongolia University of Technology, Hohhot, 010051, China

会议类型: 国际会议

会议名称: the 2012 International Conference on Frontiers of Advanced Materials and Engineering Technology (2012年先进材料与工程技术国际会议(FAMET 2012))

会议地点: 厦门

会议语种:英文

页码: 404-407

在线出版日期: 2012-01-04（万方平台首次上网日期，不代表论文的发表时间）