Surface Morphology and Roughness of Cu Thin Films Prepared by Ionized Cluster Beam Deposition

摘要：

　　The Cu thin films were deposited on P type Si (111) substrates by ionized cluster beam (ICB) technique.The surface morphology and roughness of Cu thin films were studied at different deposition condition by atomic force microscopy (AFM).The results show that the average grain size and surface roughness of the Cu thin films deposited at an acceleration voltage of 3 kV is smaller than other conditions.

关键词： Surface Morphology and Roughness Cu Films Ionized Cluster Beam (ICB) Atomic Force Microscopy (AFM)

作者: Bo Cao Tongrui Yang Gongping Li SeongJin CHO Hee KIM

作者单位: School of Nuclear Science and Engineering, North China Electric Power University, Beijing, 102206, C School of Nuclear Science and Engineering, North China Electric Power University, Beijing, 102206, C School of Nuclear Science and Technology, Lanzhou University, Lanzhou, 730000, China Department of physics, Kyungsung University, Pusan, 608-736, South Korea

会议类型: 国际会议

会议名称: the 2012 International Conference on Frontiers of Advanced Materials and Engineering Technology (2012年先进材料与工程技术国际会议(FAMET 2012))

会议地点: 厦门

会议语种:英文

页码: 419-422

在线出版日期: 2012-01-04（万方平台首次上网日期，不代表论文的发表时间）