Gas Phase Phosphorus Heavily-doped FZ Silicon Thermal Field Design and Growth Method
This paper introduces the fabrication method of a kind of gas phase phosphorus heavily-doped float zone (FZ) silicon,including thermal field design (electromagnetic copper coil with double water cooling system).This method solves the problems during the pulling process of heavily-doped FZ silicon crystal of phosphorus doped.The gas phase phosphorus heavily-doped FZ silicon crystal using this methods with low oxygen content (less than 0.2ppma),low radial resistivity variation (less than 10%),low resistivity (the minimum of 0.002 ohm.cm),and is good to meet the transient voltage suppressor (TVS) for silicon substrate material requirements.
Float zone Gas phase, Heavily-doping Thermal Field Phosphorus
Xuenan Zhang Jianhong Li Yutian Wang Changxu Zhang Chungeng Yang Haoping Shen Jihui Wang
School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, China; Tianjin Hua Tianjin HuanOu Semiconductor Material and Technology Co., Ltd., Tianjin, 300384, China School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, China
国际会议
厦门
英文
929-932
2012-01-04(万方平台首次上网日期,不代表论文的发表时间)