Research on Moulding Process and Dielectric Property of Polyimide Foam

摘要：

　　Foaming moulding process,cellular structure and dielectric property of polyimide (PI)foam which has been prepared by esterification method were discussed.Research results showed that the cell of prepared PI foam was well-distributed and its pore volume and porosity were bigger by microwave heating when methanol was used as the foaming agent and its content in the polyester ammonium salt (PEAS) precursor powder was 13-15%; meanwhile,the dielectric constant and loss factor of PI foam were lower.

关键词： polyimide moulding process cellular structure dielectric property

作者: Kailiang Qi Guangcheng Zhang

作者单位: Department of Applied Chemistry,School of Natural and Applied Science,Northwestern Polytechnical University,Xian,710129,P.R.China

会议类型: 国际会议

会议名称: the Asian Workshop on Polymer Processing 2011(2011高分子加工技术亚洲研讨会(AWPP2011))

会议地点: 青岛

会议语种:英文

页码: 215-219

在线出版日期: 2011-11-04（万方平台首次上网日期，不代表论文的发表时间）