Study on Curing Process of Resin Nanocomposites

摘要：

　　In order to get an optimum performance of composite materials,it is of crucial importance to select the best curing process,on condition that resin and curing agent system is determined.In this paper,we studied the curing non-isothermal dynamics of the nmSi02 / epoxy resin system,and calculated the activation energy and reaction series,according to Kissinger,Ozawa and Crane method.We found out the peak temperature,the theory gel temperature and the theory curing temperature with extrapolation as heating rate β =0.Finally we determined the best curing process range of the system.

关键词： resin nanocomposites curing process epoxy resin

作者: Chuansheng Wang Ruiqin Wang Yuan Wang Yongxiang Fu

作者单位: Shandong Provincial Key Laboratory of Polymer Material Advanced Manufacturing Technology College of Electromechanical Engineering,Qingdao University of Science & Technology,Qingdao,266061,Shandong,China

会议类型: 国际会议

会议名称: the Asian Workshop on Polymer Processing 2011(2011高分子加工技术亚洲研讨会(AWPP2011))

会议地点: 青岛

会议语种:英文

页码: 349-354

在线出版日期: 2011-11-04（万方平台首次上网日期，不代表论文的发表时间）