Study on Wafer Thinning Characteristics of Ultimate Diamond Disk
Silicon wafer is machined by diamond cutting tools to certain extent,the cutting tool currently used is polycrystalline diamond (PCD).However,as its cutting edges are not leveled to the same height,it will produce different depth of cut and the stress distribution is uneven on wafer surfaces,in the process of wafer thinning,both the workpiece and the cutting tool are probably damaged,this will increase the production cost accordingly.In this paper,a strategy is described to improve the ability of cutting tool for wafer thinning,a cutting tool named Ultimate Diamond Disk (UDD) designed by Taiwan Wheel Company is recommended,which can reduce both the crack of workpiece and the wear speed of cutting tool.Moreover,an experiment on base of different machining parameters including rotation speed of spindle,feed rate and depth of cut was tested and discussed.As a result,the removal mode of workpiece material and the wafer thinning characteristics of UDD are obtained.
Ultimate Diamond Disk wafer thinning cutting crack
Xu Xing JIN
Wuxi Institute of Technology,Wuxi,214121,China
国际会议
广州
英文
476-479
2012-11-16（万方平台首次上网日期，不代表论文的发表时间）