A new method for measuring the residual stresses in multi-layered thin film systems

摘要：

　　To meet different electrical or optical functionalities,thin films are often of multiple layers processed at high temperatures.Substantial residual stresses can therefore develop in such thin film systems due to the disparate thermal properties of the individual material layers.High stresses can lead to mechanical failure of the systems and thus understanding the residual stresses in thin film systems is important.This paper presents a systematic way to characterize the residual stresses in epitaxial,polycrystalline and amorphous layers by using X-ray diffraction (XRD) techniques.The single-point XRD pattern renders the stresses of crystalline layers and the scanning XRD gives the curvature of the whole film.Based on the newly-developed analytical model,the residual stresses of each layer can all be determined.

关键词： Thin films Multilayer Residual Stress X-ray Diffraction

作者: Mei Liu Haihui Ruan L.C.Zhang

作者单位: School of Mechanical and Manufacturing Engineering,The University of New South Wales,NSW 2052,Australia

会议类型: 国际会议

会议名称: the 2012 International Conference on Manufacturing Engineering and Automation (2012年制造工程与自动化国际会议(ICMEA2012))

会议地点: 广州

会议语种:英文

页码: 884-890

在线出版日期: 2012-11-16（万方平台首次上网日期，不代表论文的发表时间）