Polishing of CVD Diamond Wafers and Films
This paper investigates the applicability of the dynamic friction polishing (DFP) technique to process the chemical vapour deposition (CVD) diamond surfaces.Two types of CVD diamond specimens were studied.A stepwise polishing process was introduced to minimise the cracking in CVD thin films.The investigation focused on the polished surface quality in relation to the polishing conditions and material remove rates.It was found that by selecting proper polishing parameters,surfaces of quality finish with a roughness of less than 70 nm Ra could be obtained in 15 minutes when the specimens were CVD diamond wafers with an initial roughness of 17 μm.The polishing time could be reduced to only 2.5 minutes in the case of diamond thin film specimens of initial roughness of 1.6 μm.
CVD diamond wafer CVD diamond film dynamic friction polishing surface quality material removal rate
Haibo FENG Yiqing CHEN LC ZHANG
School of Mechanical and Manufacturing Engineering,The University of New South Wales, NSW 2052, Australia
国际会议
广州
英文
373-376
2012-11-16（万方平台首次上网日期，不代表论文的发表时间）